Frontgrade Applied sciences has developed a plastic-encapsulated model of its UT32M0R500 radiation-tolerant microcontroller aimed toward area missions. Constructed round a 32-bit Arm Cortex-M0+ core, the plastic UT32M0R500 is about for flight grade manufacturing in July 2024 after assembly NASA’s PEM INST-001 Degree 2 qualification.
Housed in a 14.5×14.5-mm, 143-pin plastic BGA bundle, the UT32M0R500 provides the identical I/O configuration and options as its ceramic QML counterpart. It tolerates as much as 50 krads of whole ionizing dose (TID) radiation. For design flexibility, the gadget combines two unbiased CAN 2.0B controllers with mission learn/write flash reminiscence and system-on-ship performance. This integration allows designers to handle board utilization, whereas lowering each value and complexity.
“The proliferation of satellites for LEO missions is rising the demand for extremely dependable elements with environment friendly SWaP-C traits and radiation assurances,” stated Dr. J. Mitch Stevison, president and CEO of Frontgrade Applied sciences. “Including one other plastic gadget to our portfolio that’s certified to NASA’s House PEM Degree 2 strengthens our place as a trusted supplier of excessive reliability, radiation-assured units for important area missions.”
The UT32M0R500 is supported by Arm’s Keil suite of embedded growth instruments.
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