Printed Circuit Board Designer At Methode Electronics In Bengaluru


– Commercial –

Location: Bengaluru

Firm: Methode Electronics

Create, Confirm & Keep all schematics components of PCB footprint & Database Entries requested by Electrical Engineering workforce throughout all of the Divisions and comply with Methode’s present processes, collaborating with engineers and groups within the design and improvement of medium to excessive complicated, detailed layouts of inflexible and versatile printed circuit boards utilizing CAE and CAD functions and instruments.

– Commercial –

Qualification: Diploma /BSc/BE in Electronics

Whole expertise: 4 to 10 years

Major Abilities

  • Ought to be capable to create PCB footprints per IPC requirements and schematic symbols independently
  • Proficient with Footprint creation utilizing Altium Designer, Cadence Allegro.
  • Answerable for Schematic entry, designing PCB Structure to Gerber technology and launch for automotive functions
  • Information on IPC Requirements for PCB design and for element engineering
  • Proficiency in utilizing ECAD instruments
  • Passionately participates within the critiques.
  • Drive Continues enchancment in initiatives to boost course of, high quality, productiveness & cycle time enchancment
  • Suggest PCB design trade-offs to the engineering design workforce for decision and implementation
  • Information of PCB manufacturing processes.
  • Capable of work nicely in International, quick paced setting (coping with groups in India and US)
  • Sturdy verbal and written communication expertise, self-motivated workforce participant, versatile and able to adapt to various workloads and activity necessities.

Job description

  • Design and improvement of high-power PCBs, contemplating thermal administration, sign integrity, and energy integrity necessities.
  • Confirmed expertise in high-speed PCB design/Structure design, with an emphasis on HDI layouts.
  • Structure design expertise with communication interfaces corresponding to Ethernet, USB, I2C, DDRs, and so forth.
  • Sturdy information of EMI/EMC rules and requirements, and the power to implement EMI/EMC mitigation methods, together with filtering, shielding, and grounding strategies.
  • Familiarity with structure tips for manufacturability (DFM), design for meeting (DFA), and design for testing (DFT).
  • Capacity to collaborate with cross-functional groups to outline PCB design necessities and specs

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